A robust laser micromachining system designed for high-throughput production. Designed as a machine-tool, ready to fit into your production facility. C Series systems can be configured for micro-drilling, micro-cutting, micro-milling or for a combination of processes.
C-Series state-of-the-art turnkey laser micromachining systems are designed specifically to provide stable, reproducible production in a tough environment. The C Series is built around a massive granite frame mounted on a vibration isolation platform making the system impervious to ambient vibration. The class 1 enclosure protects the system from contamination and changes in temperature. Oxford Lasers Cimita micromachining software simplifies manufacturing by allowing you to go straight from CAD model to production.
A range of diode pumped, solid state lasers are offered, providing a range of wavelengths and powers for all production needs. With the correct choice of laser, almost all solids can be machined including: metals (e.g. stainless steel, tungsten, titanium, copper, aluminium), ceramics (e.g. alumina, zirconia, silicon nitride), super-hard materials (e.g. diamond, tungsten carbide), semiconductors (e.g. silicon), graphite and plastics (e.g. polyimide, PMMA, polycarbonate). Composites and laminates can also be machined.
In addition to being configurable for micro-drilling, micro-cutting and micro-milling, the system can be configured specifically to match your process, with options to add longer travel stages (up to 450mm X-Y and 150mm Z), galvo scanners, trepanning heads, taper control systems, automatic alignment, two rotation axes, additional chucks and fume extraction.
Please contact us to request a data sheet or to discuss your application.
