Oxford Lasers

Oxford Lasers

Precision Cutting of CVD Diamond

Diamond Cutting

Diamond, with its unique properties, finds a wide range of uses from jewellery to hard wearing cutting edges of machine tool bits.

Diamond Cutting

Intersection of four laser diode heat spreaders.
Each piece is 750x 500x350 mm and has edge taper of less than 1°

· Short pulses of high peak power at high pulse repetition frequency overcomes hardness and transparency of diamond
· Features from a few microns upwards
· No need for surface pre-treatment
· Cold ablation - low graphite formation
· Low taper – better than 2°

Diamond, with its unique properties, finds a wide range of uses from jewellery to hard wearing cutting edges of machine tool bits.

As well as being extremely hard, diamond has very high thermal conductivity (up to 5 times that of copper) and is electrically insulating. These properties make it ideal for use in the electronics industry, providing the means for thermal management in semiconductor devices, such as laser diodes.

While the properties of diamond make it attractive as an industrial material, they also make it a difficult and expensive material to machine. A suitable laser can overcome the hardness and transparency of diamond, making precision micromachining possible. Features from a few microns upwards can be produced without pre-treatment of the material and with very low graphite formation.

As well as cutting with narrow kerf width and cut edge taper of <1°, the CVL excels in other areas of micro machining where small feature size and high precision are required at high production rates, without heat damage. Micro drilling, cutting, milling, etching and high resolution marking can all be achieved from a single system.


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CS CM3