Laser processing of biomedical devices offers distinct advantages over conventional technologies. High precision cutting with minimal heat affect is possible, due to a unique combination of laser characteristics, including: wavelength, beam quality, low pulse energy, very high repetition rate, short pulse width and high average power.
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· High quality cut with minimal heat affected zone · Narrow cut width · High process speed · Process flexibility · Wide choice of materials
There are a number of key parameters that make the a laser system ideal for cutting tungsten pins in production. The minimum cut width is 5 mm compared to 20 mm for EDM, the process time is 10-20 times faster and the inherent flexibility of the laser process allows for future development. In addition the process is not limited to conducting materials enabling ceramics to be machined.
