Solutions Turn-key pour produire des cartes à pointes
Longueur d'onde de laser idéale pour percer tous substrats
Haute précision pour le perçage de trous
Géométrie du trou et diamètre d'entrée contrôlés
0.05% de résolution du diamètre du trou
Le probe drill 355 est spécialement conçu pour la production de cartes à pointes. Avec la capacité de percer des trous de moins de 50 microns de diamètre, le ProbeDrill est la réponse à vos besoins de production actuels et futures.
The turn-key ProbeDrill system is designed to produce probe cards for testing semi-conductor wafers. Capable of drilling micro-holes with diameters less than 50µm with better than 2µm positional accuracy. The advanced PC based controller and RS274 G-code programming language make operating the system a single screen process.
Ultimate hole drilling accuracy is achieved with a vibration isolated granite base whilst Oxford Lasers' proprietary trepanning system guarantees extremely round holes. The trepanning system offers a range of maximum hole sizes, depending on your specific requirements, each with 0.05% resolution. Minimum hole diameter is 5µm. Probe cards up to 200mm x 200mm may be machined in one pass, although longer travel stages are available on request. An integrated taper control system ensures that holes are drilled with parallel sides and even allow negative tapers to be achieved. A high-magnification on-axis vision system aids alignment and allows process inspection.
In common with our other systems, the ProbeDrill may be upgraded with 2.5D CADCAM, galvo scanners, auto-focus and auto-alignment, beam profiling, high-resolution off-axis cameras, various chuck options and height/depth sensors.
Applications
Production de cartes à pointes semiconducteurs
Micro perçage dans: Nitrure de silicium, Aluminium, Silicone, Polyamide, Céramique
Perçage de trous de formes rondes, carrées et rectangulaires
