Probe Card Drilling

Micro Drilling of Probe Card Substrates

Laser processing offers distinct advantages over conventional technologies. High precision drilling with minimal heat affect is possible and this can be achieved with no burr or micro-cracking.

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Key Features:

Small holes
Very close spacing
Fast drilling in most hard materials
High volume production
Smooth clean walls
Sharp, well defined edges
Process flexibility
Minimal dross and heat affected zone

Typical results:

Shape	Square Holes	Round Holes
Thickness	350 µm	500 µm
Nominal Exit Size	60mm x 60 µm	70 µm
Exit Tolerance	+/- 3 µm	+/- 2 µm
Drill time	30 seconds	9 seconds

Designed for Probe Card manufacture, the ProbeDrill series of precision laser drilling sytems can produce large arrays of holes, both circular and rectangular, in the range of 40 to 500 microns (µm) across with very high packing densities.

Spécialistes des systèmes Laser

Micro Drilling of Probe Card Substrates

Key Features: