Our expertise includes laser micromachining, micro drilling, laser drilling, micro holes, laser cutting, precision machining, fine cutting, micro fabrication, laser ablation, photonics, MEMS, scribing, etching, laser marking, laser engraving and micro milling.
Laser drilling can be used to produce micro-holes in almost any material. Oxford Lasers offers laser drilling systems and services for micro-hole production and R&D. read more »
Laser precision cutting is an attractive micromachining technique for most materials. Features down to 1 micron wide and up to 2mm deep can be machined. read more »
Patterns or shapes can be engraved onto any material. Decorative markings or barcodes can be written at high speed with high accuracy. read more »
Laser ablation is commonly used for patterning thin films to produce small features or isolate regions within a device. Applications of laser ablation of thin films includes production of photovolatic cells (e.g. CIS, CIGS, amorphous silicon) and flat panel displays (ITO patterning). read more »
Drilling fine pitch vertical probe cards for semiconductor testing. We can routinely micromachine holes with diameters down to 50 microns. read more »
Laser machining of the holes in fuel injector nozzles guarantees accuracy and high quality read more »
Lasers can be used to scribe fine features in any material. This can be for surface patterning, dicing or as the first step in a "scribe and break" process. read more »
Micro-milling can be used to create 2.5D features in the surface of most materials. With the appropriate choice of process conditions surface roughness below 1 micron can be obtained. read more »
