Oxford Lasers

Oxford Lasers

Laser Micro-cutting

Silicon Cutting

Laser precision cutting is an attractive micromachining technique for most materials. Features down to 1 micron wide and up to 2mm deep can be machined.

Micro-cutting systems

Lasers can be used to micro-cut almost any material with very high accuracy. Kerf widths can be as low as 5 microns, with 1 micron achievable is certain circumstances. High peak power, short pulse lasers are normally used to ablate the material and give a very clean cut with almost no mechanical force applied to the substrate.

Once your job has been fully described to us, we select the most appropriate laser source for the job (wavelength, pulse duration, power, beam quality etc). This is then integrated into one of our ultra-stable micromachining systems to provide a tool optimised for your process and environment.

Wide variety of materials

Almost any type of material can be micro-cut. Materials which can be machined include:

  • metals: stainless steel, hardened steel, copper, aluminium, brass, tungsten, titanium
  • ceramics: alumina, zirconia, machinable ceramics, green ceramics, PZT, silicon nitride, tungsten carbide
  • super hard materials: diamond, silicon nitride, tungsten carbide
  • plastics: polyimide, PTFE, PMMA, Kapton, Vespel, Cirlex, ABS
  • glasses and crystaline materials: BK7, sapphire, fused silica

Silicon CuttingSilicon DicingSapphire DicingSapphireTungsten PinFine Cutting SteelDiamond CuttingCopper Cutting

Sub-contract micromachining

Many customers need to develop their process and establish feasibility before purchasing a laser micro-cutting system. To aid this, Oxford offers a micro-cutting service which provides access to world leading precision laser cutting technology. This can be used to develop the process and produce pilot parts. Quantities can range from one-off parts for R&D, to tens of thousands per month for volume manufacture.