Oxford Lasers manufactures a range of standard laser micro-machining systems for a wide variety of precision machining applications including micro-drilling, micro-cutting and micro-milling. Laser systems are supplied tailored for volume production or R&D. A variety of configurations are offered which can incorporate nanosecond, picosecond or femtosecond lasers operating in the IR, visible and UV to give controlled ablation of a wide range of materials. In addition the standard laser micromachining systems can be customised to tailor them to special applications or to handle specific parts. read more »
To see the wide range of high performance Laser Micromachining Systems available, click here. Use the links below to learn more about the applications of our systems and the features that we can machine.
Dedicated micro machining facilities are ready for feasibility trials, R&D, process development, sub-contract manufacture & Job Shop. read more »
Laser drilling can be used to produce micro-holes in almost any material. Oxford Lasers offers laser drilling systems and services for micro-hole production and R&D. read more »
Lasers are widely used for production of photovoltaic cells. Oxford Lasers manufactures a wide range of systems for solar cell production and R&D. These range from simple edge isolation systems to leading edge EWT and MWT drilling systems. read more »
Laser machining of the holes in fuel injector nozzles guarantees accuracy and high quality read more »
Micro-milling can be used to create 2.5D features in the surface of most materials. With the appropriate choice of process conditions surface roughness below 1 micron can be obtained. read more »
Drilling fine pitch vertical probe cards for semiconductor testing. We can routinely micromachine holes with diameters down to 50 microns. read more »
Lasers can be used to scribe fine features in any material. This can be for surface patterning, dicing or as the first step in a "scribe and break" process. read more »
Laser ablation is commonly used for patterning thin films to produce small features or isolate regions within a device. Applications of laser ablation of thin films includes production of photovolatic cells (e.g. CIS, CIGS, amorphous silicon) and flat panel displays (ITO patterning). read more »
Laser precision cutting is an attractive micromachining technique for most materials. Features down to 1 micron wide and up to 2mm deep can be machined. read more »
Patterns or shapes can be engraved onto any material. Decorative markings or barcodes can be written at high speed with high accuracy. read more »
