Many customers need to develop their process and establish feasibility before purchasing a laser micro-cutting system. To aid this, Oxford Lasers offers a micro-cutting service which provides access to world leading precision laser cutting technology. This can be used to develop the process and produce pilot parts. Quantities can range from one-off parts for R&D, to tens of thousands per month for volume manufacture. read more »
Laser micromachining is a very powerful method for the production of small scribe-marks on larger parts. Fine scribing marks can be made in most materials to allow dicing into smaller parts. This is particularly suited to the production of Solar Cells, semiconductor wafers and other substrates. read more »
Our laser micro-hole drilling service provides access to world leading precision hole drilling technology. This service can be used for R&D through to full production. Minimum micro-hole sizes can be as low as 1 micron in thin materials. read more »
Laser micromachining is a very powerful method for the production of micro-parts or micro-features on larger parts. Feature sizes down to 1 micron can be produced in the right circumstances and holes or features of 5 microns and above are routine. Oxford Lasers has a number of state of the art micromachining systems that are available for R&D or sub-contract manufacture. These systems are designed to be flexible so that many different processes can be investigated. read more »
Laser micromachining is a very powerful method for the production of micro-marks on larger parts. Marks as small as 10 micron can be produced in the right circumstances and features of 50 microns and above are very routine. Oxford Lasers has a number of state of the art micromachining systems that are available for R&D or sub-contract manufacture. These systems are designed to be flexible so that many different processes can be investigated or carried out. read more »
