Oxford Lasers

Picosecond laser micromachining can be used for the most challenging applications. The J Series combines the precision of picosecond laser micro machining with Oxford Lasers high stability granite structure and intuitive control software.

Picosecond laser micro machining ustilises a very short pulse laser (typically 12 ps duration), to prevent the formation of a heat-affected zone. Very high accuracy micro-hole drilling and micro-cutting can be performed in almost any material. The lack of thermal damage makes the J Series particularly useful for machining heat sensitive materials.

The very high peak power density that can be achieved using picosecond pulses means that this type of laser can be used to machine otherwise transparent materials such as silica or sapphire. Non-linear absorption enables the light to interact with transparent materials, causing very strong, very localised heating and ablation. In addition the strength of the laser ablation process results in a very low debris process.

The J Series is also a very powerful micro-milling tool. The very high peak power density leads to a very controlled micro-ablation process ideal for micro-milling. As described above, this can be particularly advantageous when milling trasparent materials such as quartz / fused silica or sapphire.

The class 1 enclosure single-interface computer control and turn-key operation make this system easy and safe to operate.

A vibration isolated granite bed offers ultimate stability and helps guarantee maximum repeatability and accuracy in the parts produced. With 300mm X-Y travel and 150mm Z-travel, the system is able to machine large numbers of parts (or small features in large parts) and the on-axis vision system simplifies alignment and allows the operator to check their work.

If required, we can add trepanning heads, longer travel stages, galvo scanners, taper control systems, rotational stages, height/depth sensors, auto-focus and auto-alignment, motorised attenators, temperature stabilisation and fume extraction.

Please contact our expert technical team to discuss your requirements and obtain further information