Micro cutting can be used in the removal of larger areas of material from within a substrate as well as material separation.
Laser micro cutting, being a non-contact process, can be used to create a huge variety of very intricate shaped parts. When compared to traditional cutting or sawing, extremely small cut widths or kerf widths can be obtained.
Laser micro cutting can also be used for the separation of for example the final part or to leave tabs for subsequent final part removal. It can also be used to efficiently remove areas within a substrate creating larger holes, slots or windows.
A range of examples can be found in the applications shown below.
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Laser Cutting Specification
| Minimum width of cut |
Typically 5µm |
| Maximum Material Thickness |
Typically 1mm (dependant on speed requirements) |
| Materials |
Most materials from soft plastics to hard ceramics including transparent materials |
Key Benefits
Ideal for cutting:
- Foils
- Films
- Micro-mechanical parts
- Semiconductor wafers