Laser micro-drilling can be used to produce micro-holes in any material. Oxford Lasers use their own proprietary Optical Trepanning / Drilling technology to offer laser micro-drilling systems, sub-contract microdrilling and process development services for microhole production and R&D.
Oxford Lasers has over 20 years experience using a very wide variety of short and ultrashort pulse lasers in the IR, visible and UV for laser hole drilling for leak testing, high precision pinholes, nozzles, orifices, vias, photovoltaic cells etc. Very good position and diameter tolerances can be achieved when micro-hole drilling (better than 1micron).
Market trends are for smaller holes on tighter pitches with higher aspect ratios and through the years Oxford Lasers have continued to develop a variety of special processing techniques making the placing of such small holes on very tight pitches possible.
Microdrilling of Round and Rectangular Holes a Speciality
We are known for laser drilling precision small holes and have developed a number of proprietary processes to optimise the laser micro hole drilling process. These proprietary micro drilling techniques, coupled with the most appropriate choice of laser for the job (short or ultrashort pulse, IR, visible or UV), enable us to micro-drill nozzles, orifices and vias with a very high diameter accuracy and controlled taper for a wide variety of applications.
Oxford Lasers employ a variety of drilling techniques from high speed percussion drilling through to high quality trepanning. In addition holes can be drilled normal to the surface or indeed at very acute angles to the surface unlike many other drilling techniques.
Images of Round Holes
Images of Rectangular Holes
Oxford Lasers systems and services have been used to manufacture micro-holes in fuel injection components, vertical probe cards, metered dose inhalers, calibrated leaks, pinholes and slits for scientific instrumentation, inkjet printer nozzles, detectors, sensors, high resolution circuitry, fuel cells, fibre optic interconnects and medical devices. We have experience of laser drilling small holes in metals, ceramics, diamond, silicon and other semiconductors, polymers, glass and sapphire using industrial IR, visible and UV lasers.
Recent developments (patent applied for) have enabled the small hole drilling of rectangular and other, more complex shapes. These holes have wide application and can again be drilled in a very wide variety of materials including metals (e.g. stainless steel, tungsten, titanium), glass, ceramics (e.g. alumina, silicon nitride) and plastics (e.g. polyimides, polycarbonate).