Laser micro milling can be used to selectively remove material from a wide variety of substrates, to form a wide range of blind features from pockets and channels to chamfers and many other 2.5D structures.
Not only can the volumetric removal rate of these features be controlled with the correct choice of laser, but through various processing strategies, very accurate control of the features surface roughness can be obtained.
A range of work examples can be found in the applications shown below.
Contact us for more information or to request a quote.
Laser Milling Specification
| Minimum Feature Size |
10µm |
| Maximum Material Thickness |
Milled features can be put in most substrate thicknesses |
| Materials |
Almost any material. Contact us to discuss your requirements |
Key Benefits
- Low surface roughness
- Complex shapes
- Micron level dimensional control accuracy