Laser scribing is a laser micromachining technique which involves scanning a laser beam across a substrate to produce a series of blind cuts or scribe lines. These scribe lines can then be used to 'break' or 'singulate' wafers or substrates.
Laser micro scribing is a laser micromachining process which is used extensively for volume production of semiconductor wafers, fabrication of blue LEDs and photovoltaic cells for the solar industry, where very fine control over the scribing leads to an extremely well defined break, which is clean and can be free of micro-cracking.
Scribing can also be used for surface patterning, dicing or as the first step in a ‘scribe and break’ process. The scribing technique has the benefit of being a much faster process than laser cutting through a complete substrate.
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Key Benefits
- Enables fine control
- Extremely fast process
Laser Scribing Specification
| Minimum Width Of Scribe |
5µm |
| Aspect Radio |
Up to 30:1 |
| Maximum Material Thickness |
Typically 1mm |
| Materials |
Most materials from soft plastics to hard ceramics and transparent materials |