Sub-Contract Micro Scribing

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Laser micromachining is a very powerful method for the production of small scribe-marks on larger parts. Fine scribing marks can be made in most materials to allow dicing into smaller parts. This is particularly suited to the production of Solar Cells, semiconductor wafers and other substrates.

Scribes as small as 10 micron can be produced in the right circumstances and features of 50 microns and above are very routine. Oxford Lasers has a number of state of the art micromachining systems that are available for R&D or sub-contract manufacture. These systems are designed to be flexible so that many different processes can be investigated or carried out.

The laser systems can be used for micromachining, micro-drilling, micro-cutting, precision machining, fine cutting, microfabrication, ablation studies, MEMS, scribing, etching, marking, engraving and milling. Laser micro machining can often be a more cost-effective alternative to techniques such as micro EDM.


Our technical team has been working on laser micromachining for nearly 20 years, and we have experience in scribing parts in many different materials. Contact us with your requirements to find out how we can help.

Oxford Lasers, Inc
2 Shaker Road, Unit B104, Shirley, MA 01464, USA

Oxford Lasers Ltd.
8 Moorbrook Park, Didcot, Oxon, UK, OX11 7HP

  • T: +44 (0)1235 810088 (general/service)
  • T: +44 (0)1235 814433 (micro-machining)
  • T: +44 (0)1235 812255 (imaging)
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