Thin-film patterning is a selective laser ablation process which allows extremely precise removal of single or multiple layers from a material substrate to create precision circuits.
The technique of laser thin-film patterning can produce track and gap widths down to 5µm and with galvo control allowing full design flexibility for one offs to volume production. During the process, the laser beam is scanned over the surface to produce the desired pattern. By altering the number of pulses at each point the depth of mark or pattern can be controlled.
The flexibility of this process is such that it allows for the creation of a wide variety of of features and circuit patterns without the need for a mask. This technique can easily achieve sub-micron selectivity with no damage to the underlying substrate.
An alternative to photolithographic printing, laser thin-film patterning is ideal for rapid prototyping of flexible electronic devices due to the extremely fast process speeds achievable. In addition to contract services, Oxford Lasers also offers a standard system, which can be customised with different laser options, to meet your individual demands.
A sample of thin-film patterning applications can be found below.
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Laser Thin-Film Patterning Specification
| Minimum track width |
5µm |
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| Materials |
Metals
Most Transparent Conductive Oxide materials (TCO’s): from Indium Tin Oxide (ITO) to Zinc Oxide (ZnO)
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Key Benefits
- Sub-micron selectivity
- Zero damage to substrate
- No mask required
Examples of the thin-film patterning process in research
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