Thick-film patterning is similar to thin-film patterning in that selective laser ablation is used to remove the material in specific locations to create the ‘pattern’ required.
However, it differs from thin-film patterning in that the films removed generally tend to have thicknesses of several tens of microns.
By using laser micromachining, the material to be ablated is specifically selected by the laser and therefore, masks are not required to protect the remaining material (similar to techniques like wet etching). The micromachining process is very fast with track cutting speeds in the range of 10 – 50mm/s being possible.
When laser trimming, the micromachining process is used to modify the electronic properties, most often with an active feedback loop to ensure accurate performance of particular elements within a circuit.
Examples include creation of ultrasonic transducers and MEMS devices by the selective scribing of metals, thick films (nickel, copper and gold) from PZT substrates. Other examples include patterning of Cu on FR4 or Alumina for the creation of circuits etc.
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Laser Thick-Film Patterning Specification
| Minimum track width |
5µm |
| Maximum Material Thickness |
30µm |
| Materials |
Metal films on ceramics (alumina, FR4, PZT etc.) |
Key Benefits
- Micron selectivity
- Zero damage to substrate
- No mask required