This group of materials, with conductivities that fall between normal conductors and insulators, can be laser machined with extremely high precision irrespective of whether they fall into the class of materials that form the intrinsic or extrinsic group.
Laser micromachining can be used to process almost all semiconductors with ultra-high accuracy and precision. This can be particularly important as devices shrink in size where tolerances become ever more demanding. Lasers not only allow drilling of hard semiconductors like Silicon Carbide and Diamond, but also micro cutting where laser kerf widths are significantly reduced compared to conventional dicing or sawing.
Many semiconductor materials e.g. Silicon can not only be drilled and cut but can also be trimmed and the material wafers re-sized. Wafer resizing can routinely be achieved on wafers up to 300mm.
In addition, it is possible to mill or thin these semiconductor materials with degrees of precision approaching a few microns. This can be particularly useful for creating new devices or for semiconductor analysis.
A sample of semiconductors we can machine include:
Gallium Arsenide | Germanium | Silicon | Silicon Carbide | plus many more...
The materials detailed above are purely a summary overview, therefore if the material you are interested in working in is not listed, please contact us.