Oxford Lasers (Didcot, UK) are pleased to announce the launch of Innovate UK funded project PITCH. This is a £0.5M industrial research project coordinated by Oxford Lasers Ltd which was submitted under the competitive Innovate UK Smart Grants initiative.
The programme will develop novel laser drilling technologies for advanced packaging in semiconductors. With More-than-Moore’s law increasingly driving the adoption of advanced packaging technologies, test probe cards become crucial for semiconductor wafer-level testing. Such sophisticated, custom-made probe cards are used for each IC design to establish Known-Good-Die (KGD) before packaging. PITCH will develop ultra-high precision laser drilling for the next generation affordable fine-pitch probe cards which are urgently required by node size reduction below 5nm.
Dr Dimitris Karnakis, technical manager - R&D projects commented “I am delighted to get the opportunity to coordinate such a cutting-edge project which will focus on the needs of increasingly more critical chip manufacturing processes. Oxford Lasers has a long track-record in developing innovative solutions in this field and I am certain we will continue on this path with new advanced laser technology aimed at next generation probe card manufacturing.”
PITCH kicked off on 01 September 2022 with a project duration of 18months.